Used KAIJO FB 880 #9200927 for sale

KAIJO FB 880
Manufacturer
KAIJO
Model
FB 880
ID: 9200927
Wire bonder.
KAIJO FB 880 bonder is a state-of-the-art equipment for adhesive application and bonding of different substrates for various applications. This advanced device can be used for rapid production at high accuracy rates and covers a wide range of materials, including films, papers, textiles and foils. KAIJO FB-880 bonder combines three technologies into one machine - a dispensing system, a heat bonder and a smart positioning mechanism. FB 880 dispensing unit has a built-in microcomputer and can execute highly accurate adhesive application and bonding. The precision of the application can be adjusted from 5 to 50 microns, with a very low CV. It is also equipped with an auto-zero machine that can precisely zero out the dispensing head for accurate position control. The sophisticated controller also stores a variety of different dispensing parameters for quickly switching between production tasks. FB-880 bonder is also equipped with a high-precision heat bonding head capable of accurate temperature control. Temperature control range is from 30°C to 400°C with variable power output of up to 900W. This ensures each workpiece is heated steadily and evenly for correct temperature across the entire surface. It also features a smart positioning mechanism that automatically senses the surface of the workpiece and adjusts the power level and temperature accordingly for precise bonding. KAIJO FB 880 bonder is capable of operating in any working environment and is suitable for both manual and fully automated production setups. Its ergonomic design allows users to easily access all the controls while it is in operation, and its easy-to-read LCD screen allows for quick setup and operation. The device is also protected by a three-phase motor overload protection tool, which ensures it runs safely and reliably. Overall, KAIJO FB-880 bonder is an excellent choice for quickly and accurately applying adhesives and other substances to various substrates. Its advanced technology provides for highly accurate dispensing, heat bonding and positioning, making it suitable for a wide range of applications.
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