Used KAIJO FB 880 #9208414 for sale

KAIJO FB 880 is an advanced microprocessor-based table-top bonder designed for automated and high-quality contact and thermocompression bonding. It is equipped with an automated vision equipment for providing highly precise alignment and is configured with an easy-to-operate user interface. The bonder has a unique actuator head movement system for optimizing throughput and providing uniform temperatures to the entire bonding region to prevent bond defects caused by temperature variation. It is capable of processing various types of bonding with a wide range of temperatures, from room temperature to over 350°C, with minimal thermal strain. The 880 is also fitted with a thermal barrier unit for controlling temperature fluctuations and to provide uniform temperature to the bonding area for higher-quality bonding performance than ever before. The 880 is also equipped with an advanced air cooling machine for faster cooldown and improved thermal stress control during high-speed and/or high-temperature thermocompression bonding. KAIJO FB-880 is designed for high-precision, high-throughput electronic device assembly. It features sub-micron accuracy linear and rotary motors, precision closed-loop servo-control, precise real-time temperature monitoring, and automatic vision alignment, enabling precise placement and z-axis control for intermediate bonding. Its protective windows help block UV radiation and accidental splashes during operation. FB 880 also features manual or automatic substrate loading systems to reduce cycle times and improve component placement accuracy. The 880's mechanical tool incorporates a state-of-the-art vibration isolation and motion dampening asset, creating a precise and stable working platform. Finally, it's equipped with remote I/O for easy integration into existing production systems. FB-880 is the perfect solution for high-precision, high-throughput thermocompression and contact bonding applications. By providing a range of features, it ensures high-quality bonding and superior throughput, allowing us to meet customer's requirements for improved efficiency and product quality in a cost-effective package.