Used KAIJO FB 900 #293671823 for sale

KAIJO FB 900 is a high-performance bonder designed for advanced semiconductor applications. This device is capable of placing and bonding wide variety of materials such as AlGaAs, quartz, alumina, silicon wafer, and a range of ceramic packages. Featuring an excellent alignment accuracy of 12.5 µm, the device can accurately form a variety of different bonds without the need for an additional process step. FB 900 utilizes advanced pressure-control technology to create optimal bonding conditions. This feature allows for precise control of both mechanical and thermal parameters while bonding. The device is outfitted with an easy-to-use control panel, and allows for flexible programming according to specific customer requirements. The bonder is powered by a multi-valve heater assembly, which provides uniformly distributed heat energy to ensure that the bond is complete. This feature ensures that the bond forms quickly and accurately, and can reliably bond a wide range of materials with minimal contamination. KAIJO FB 900's robust design includes a robust multi-axis stage to enable accurate placement and equipment protection. Its integrated light curtain technology prevents accidental operator contact with high-temperature components. Additionally, the device includes a dust filter to prevent the introduction of contamination to the observation area. The environment within the device is also constantly monitored to ensure optimal conditions for welding. FB 900 is also equipped with an integrated recipe unit which permits quick and simple creation of complex welding recipes. This allows users to easily program and store specific welding parameters for later use. In addition to its advanced features and sophisticated design, KAIJO FB 900 is built to ensure long-term maintenance flexibility. The bonder is designed for easy-access to its internal systems and components, enabling rapid fault-finding and servicing. This makes FB 900 an ideal candidate for long-term, reliable operation.