Used KAIJO FB 910 #9383556 for sale

KAIJO FB 910 is a high-end, top-of-the-line bonder designed for a wide variety of semiconductor packaging applications. FB 910 is a fully-automatic, single beam, pick-top and place bonder that utilizes DC arc melting tungsten as its source of heat. Featuring a fully closed-loop temperature control equipment, KAIJO FB 910 is capable of sub-10 micron accuracy with its iron-shell protection mechanism. Additionally, FB 910 utilizes an advanced FLIR imaging vision system for precise chip placement, and is capable of working with a variety of materials, such as polyimide, polyimide-glass, as well as copper. Featuring a high-precision, servo-driven motion mechanism, KAIJO FB 910 provides a reliable, consistent process for a wide range of packages. It also has the following features: Tape-die/coil-die Bonding - for a wide variety of die-attach and bonding applications, Gold Wire Bonding - using a high-precision crystalline wire bonding unit, Sub-micron pitch capability as well as advanced placement and alignment algorithms, On-board smart diagnostics - for preventive maintenance, as well as fast fault analysis and correction, Anti-static grounding machine - which reduces the occurrence of static electricity, A 24-hour, non-stop availability - for maximum output, and A precise adjustable placement reminder - that allows users to adjust the bonder position in order to meet specific needs. FB 910 is a world-class bonder ideal for any assembly application that requires advanced precision and accuracy. Its design parameters are driven to meet the highest quality standards, and its performance has been tested and certified against a wide variety of industry standards. On top of that, the advanced servo-driven motion mechanism has made KAIJO FB 910 the benchmark in automated die-attach and wirebonding applications.