Used KAIJO FB e18 #9380405 for sale

KAIJO FB e18 is a fully automated and programmable bonder from KAIJO Corporation. It is suitable for both high- and low-volume production and can be used for a wide range of applications, including dicing, die bonding, and component placement on substrates. The bonder features a maximum chip size of 18 x 18 mm and a mounting pitch of 150 µm or less. FB e18 is equipped with a high-performance vision equipment, including a light source, an image-capturing camera and a programmable chip sorter, to ensure accurate and reliable device placement. The robust and reliable substrate attachment system ensures repeatable, minimum damage to all types of substrates, regardless of their size and shape. The bonder is equipped with a powerful bond heads, complete with control and recognition systems, to execute precise and repeatable die and component placement on substrates. The bond heads are designed to apply a precisely-controlled amount of heat and pressure to create bonded connections. KAIJO FB e18 also features an advanced control unit, which enables users to monitor, control and analyze all aspects of the bonding process. The machine offers an array of feedback, alarms, and error corrections in real-time. Additional features, such as easy programmability, automated operation, and user-friendly graphical interface, make FB e18 suitable for high-volume production. KAIJO FB e18 bonder reduces production time and manufacturing costs. It is suitable for a wide range of applications, including semiconductor test and assembly for memory chips, CPUs, and wireless components. The low-maintenance and reliable design of the bonder ensures a consistently high level of performance for all applications.