Used KAIJO FB e18S #9379382 for sale

KAIJO FB e18S is a high-precision bonding machine designed for ultra-fine thermocompression bonding. This bonding machine is used to join a wide range of materials such as silicon chips, RCCs, polymer substrates, metals, and glass. Its thermocompression capability provides a reliable and efficient bond of low- and high-k dielectric films and organic substrates. FB e18S is designed with an easy-to-use control system and a wide range of parameters to choose from, allowing a wide range of process options. It features a spectrum of vacuum control, temperature control, and thermocompression pressure control to accommodate the wide range of products used in today's R&D experiments. The built-in temperature and pressure monitors ensure that the process is conducted safely and precisely. KAIJO FB e18S is equipped with two bonding heads, each with its own active slide rail. This eliminates the need for additional tooling and thus reduces the cost and complexity of producing a bond. The adjustable pressure control has the ability to flexibly adjust the bonding force to achieve reliable bond without fear of damaging delicate micro components. FB e18S is capable of bonding large substrates with a maximum area of 48mm x 24mm and a maximum thickness of 4mm. This makes it ideal for more demanding applications such as MEMS bonding and precision bonding of small and easily-damaged components. The built-in vision system allows for real-time image capture and analysis to ensure that the bonding process is conducted correctly. The versatile KAIJO FB e18S is a high-precision bonding machine that can accommodate a wide range of materials and products. Designed for speed and precision, the machine is a cost-effective solution for R&D experiments, micro-water bonding, and similar applications. Its adjustable pressure control, built-in vision system, and adjustable speed control allow for a wide range of process options with precise and reliable results.