Used KAIJO MPB 1140 #78220 for sale

KAIJO MPB 1140 is a world-class bonding machine manufactured specifically to meet the micro-chip and semiconductor industry's packaging requirements. This advanced bonder is characterized by its efficient and multi-functional design and its high-performance capabilities. MPB 1140 produces durable bonds between components, utilising either thermocompression bonding, ultrasonic welding, or a hybrid process. This bonder is outfitted with modern features including a custom-built optical head, force-controlled linear motor, and a PLC-controlled motorized precision fine profile tooling. In addition, it offers a wide variety of options to deliver maximum performance. KAIJO MPB 1140 offers a heated die attach process and works by clamping, then preheating and bonding conductive surfaces. With its custom-built optical head, the device is able to confirm the positioning of the parts with a microscope before starting the bonding operation. Plus, its force-controlled linear motor ensures that the parts stay in their exact position to increase the precision and accuracy of the bonding process. MPB 1140 also features an automated pressure cycling system, which incorporates a PLC-controlled motorized pressure-controlled fine profile tooling. This feature helps to ensure a steady and accurate pressure operation through the entire process, while also reducing the risk of any damage on the components. Overall, KAIJO MPB 1140 is a reliable and efficient bonder, designed to meet the needs of the micro-chip and semiconductor industry. It features advanced features like an optical head, a force-controlled linear motor, and a PLC-controlled motorized pressure-controlled fine profile tooling. These features ensure the maximum precision of the bonding process and reduce the risk of any damage during the operation. Its multi-functional design, combined with its robust performance, make MPB 1140 a perfect choice for anyone looking for a reliable and high-performance bonding machine.