Used KARL SUSS / MICROTEC ABC 200 #9204391 for sale
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ID: 9204391
Wafer Size: 8"
Wafer bonder, 8"
Optimized for aligned fusion bonding
Adhesive
Thermo compression
Anodic triple stack bonding
SUSS MICROTEC MHU 200AA179
FL Current: 100.0 A
Interrupt capacity: 5 kA
Maximum individual load: 6.5 A
GENMARK GB8-MT-80050601 Manipulator
(6) Module stations
Input:
Vacuum 8 mm 150 mbar
Nitrogen 8 mm 100 PSI
8 Bar: 120 PSI
Air 8 mm 120 PSI
8.25 Bar maximum 110 PSI
7.5 Bar minimum
SUSS MICROTEC Pressure switch S1001EBR10-018
GENMARK Automation system controller, P/N 980010658A2 MDL Large
GP Robot firmware version: GB8YPE - 6.38 beta 8
Supply voltage: 208 VAC, 60 Hz, 4 Wire, 3-Ph
SUSS MICROTEC CP200 06,1006225
Interrupt capacity: 14 kA
FL Current: 6.8 A
Maximum individual load: 6.5 A
SIEMENS Sitop
OMARON CPM2C
(2) 20EDR
(2) TS001
Supply voltage: 208 VAC, 50/60 Hz, 1-Ph
(2) SUSS MIROTEC SB150/200 06,1000344
TYCO 2M50FC Boards
Input for N2 7 bar maximum
Air 7 bar maximum
Vacuum 100 mbar maximum
Power: 230 V at 25 A / Phase
SUSS MICROTEC BA200 Plus Gen II 06,1025253
FL Current: 25 A
Maximum individual load: 2.5 A
XYZ Microscope left:
AEROTECH ES16434-3
ALS10020 / ALS10008 / ABL10025
XYZ Microscope right:
AEROTECH ES16434-4
ALS10020 / ALS10008 / ABL10025
AEROTECH ES16434-11
ALS1000 Style linear motor stage
75 MM-NO HC-LT-M-Y-CM
Right micro: 6/9, 6/24 6/2, 6/25 6/1, 6/6, 6/5, 6/26 6/3, 6/27 6/4, 6/8, 6/7, 6/20 6/2, 6/13, 6/12 6/1, 6/11, 6/10, 6/17, VAK, 6/12
Left micro: 6/9, 6/4, 6/3, 6/6, 6/5, 6/1, 6/2, 6/8, 6/7, 6/12, 6/13, 6/23 6/4, 6/22 6/3, 6/5, 6/8, 6/15, 6/7, 6/6
Supply voltage: 208 VAC, 50/60 Hz, 4 Wires, 3-Ph
(2) SUSS MICROTEC SB150/200 06,1000344
Interrupt capacity: 10 kA
FL Current: 20 A
Maximum individual load: 17.5 A
HITECH INSTRUMENTS K1550 Gas analyzer
HITECH INSTRUMENTS Z1030 Oxygen analyzer
Dual heater power controller: 06, 1002223
FESTO ADVU-50-20-P-A, 000000, 00156552 VN41, Pmax=10 bar / 145 PSI
GSM057-L/08/06 Reactor
Supply voltage: 208 VAC, 50/60 Hz, 4 Wires, 3-Ph
Includes:
(4) GOODRICH ITAR Sensors
(2) NAVITAR 1-60350IR Lenses
(2) NAVITAR 1-62922 2X F-Mount lenses
NAVITAR 1-62922IR 2X F-Mount lens
(2) NAVITAR 1-60350IR With MITUTOYO M plan apo NIR 10x / 0.26
(3) Bonder covers
VIEWSONIC VX2239WM: (3) Displays
PROMIS ID FG41018 Chuck
PROMIS ID FG41003 Chuck
TSA BA Chuck
EDWARDS XDS10 Pump
(2) BOC EDWARDS XDS10C Pumps
(2) Perfection WM-4042-61: 04/08, 09/05 Cassettes
ERGOTRON Manipulator table
LAUDA WK1200 Circulation chiller.
KARL SUSS / MICROTEC ABC 200 is a professional grade, advanced wafer bonder for precise bonding applications. It offers high-precision alignment with a positional accuracy of 0.3 micron for wafer bonding microstructures and MEMS structures. It has a modular design with a fully automated alignment and assembly equipment that allows the bonder to handle a wide range of bond processes. The bonder supports a variety of die-to-die and die-to-substrate bonding processes including several types of eutectic as well as thermocompression and anodic bonding. It is designed to bond specifically with a precise repeatability and yield of 0.01-0.1%. MICROTEC ABC200 features a powerful laser ablation system for precision alignment and repetition, as well as a proprietary vacuum robot unit for precise handling of wafers including nanowafer and MEMS structures. It has an integrated X-Y positioning machine with precision and repeatability of 0.03 microns for accurate assembly. The wafer size range (117 mm to 200 mm diameter) supports most industry-standard wafer sizes. It is able to bond wafers up to a thickness range of 10 microns to 500 microns with an aluminum oxide layer or other bondingable materials. KARL SUSS ABC-200 also offers an advanced automated control tool that is able to interface with numerous accessories, making it easy to customize the established process parameters. It has two 7-inch touch screen displays and two industry-standard logic ports, allowing users to intuitively program and control every aspect of the wafer bonding processes. To provide a comprehensive view of the entire bonding process, MICROTEC ABC-200 features a full suite of monitoring and logging functions as well as real-time process analysis options. KARL SUSS ABC 200 is an exceptionally versatile and reliable bonder for advanced wafer bonding applications. It offers excellent precision, repeatability and yield with the integrated automated control asset ensuring efficient, reliable wafer bonding processes.
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