Used KARL SUSS / MICROTEC ABC 200 #9398711 for sale

KARL SUSS / MICROTEC ABC 200 is a versatile, high-precision die bonder built for the efficient assembly of components on printed circuit boards (PCBs). It is a fully automated solution that offers fast and accurate results. The device is designed using a "push-bond" technique, which uses pressure and heat to join components to a PCB. Using an integrated vision system, MICROTEC ABC200 can be programmed to align the components with remarkable precision, providing a maximum bond area of up to 0.32mm depending on the component size. The X, Y and Z-axis can move up to a total range of 390mm x 280mm x 50mm respectively. A unique design feature is the ability to quickly adjust to different component sizes without the need for costly and time-consuming tool changes. KARL SUSS ABC-200 is powered by an adjustable, flexible control user interface. The touchscreen panel allows for easy navigation, monitoring of process parameters, and the possibility to store recipes for multiple applications. The intuitive user interface is designed to make the programming, set-up and control of the machine accessible for novice or experienced users alike. KARL SUSS / MICROTEC ABC200 is compatible with a range of thermoplastic and thermoset die-attach materials as well as various lead-frame configurations. All components, such as diodes, resistors, discrete components, ICs and similar devices with a pitch on 0.2mm, 0.3mm, 0.4mm or 0.5mm can be bonded with MICROTEC ABC 200. The machine is also capable of processing components with a width of 1-5mm in a variety of soldering methods. ABC-200 offers precision and speed, providing an efficient and reliable solution for PCB component assembly. This versatile, high-quality machine enables assembly challenges that would be difficult or impossible to realize manually to be solved in an automated process. It can significantly increase the speed of production and reduce costs associated with component assembly.