Used KARL SUSS / MICROTEC ABC 2000-11 #9148183 for sale

ID: 9148183
System P/N:61240-09.
KARL SUSS / MICROTEC ABC 2000-11 is a wire, ribbon, and thermocompression bonder that is used for a variety of different scientific and industrial applications. It is capable of accommodating a wide range of substrates, as well as various leadframes, pin grid arrays, and flip chips. It can be used for die and ribbon bonding, as well as heavy wire bonding techniques. This is a fully automated bonder with an adjustable and reliable process control equipment that ensures both accuracy and productivity. MICROTEC ABC 2000-11 can bond wires ranging from 12µm to 500µm and ribbon sizes up to 4mm wide with an accuracy rate of up to 0.2um. It has a single bond head and a single heater that is controlled by its advanced process control system. It also features an integrated vision unit and can bond speeds up to 200mm/sec. It has a high-resolution microscope that allows operators to closely monitor and inspect the bond quality at every stage. KARL SUSS ABC 2000-11's process control machine is programmable to quickly adjust to changing substrate sizes and bonding parameters. It has an adjustable pressure tool that can be used for fine tuning based on wire diameter, materials, and the type of bonds. The process window for satisfactory bonding can be adjusted to specific applications, resulting in more consistent and accurate results. ABC 2000-11 is a reliable and durable bonder that can handle a wide variety of substrate sizes and materials. Its advanced process control asset and adjustable pressure model allow it to quickly adapt to different bonding conditions and ensure quality results every time. It is a versatile bonder suitable for both industrial and scientific applications, and its high-resolution microscope allows operators to closely monitor the bond quality. This is an efficient and reliable bonder that will provide optimal results for any application.
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