Used KARL SUSS / MICROTEC ABC #9210355 for sale

KARL SUSS / MICROTEC ABC is a wafer bonder developed specifically for researchers and engineers in the semiconductor industry. The equipment uses advanced direct bonding technology to produce superior bond strength and electrical performance, while maintaining the lowest possible temperature to protect the delicate structures of sensitive substrates. Its precise, automated bonding process enables users to quickly and reliably bond wafers together and achieve seamless interfaces between them. MICROTEC ABC offers a variety of feed tables for handling up to 300 mm wafers. The system's patented cooling unit helps reduce the temperature of the bond area, improve accuracy, and minimize stress and strain on substrates. It also features an in-line liquid crystalline temperature control machine that provides dynamic temperature settings for the individual bonding areas, as well as a software-controlled pressure tool that allows for greater precision during the bonding process. KARL SUSS ABC is equipped with a TwinVision dual camera asset that fully automates the image acquisition and alignment process. This ensures precise bonding of wafers with a high degree of accuracy and repeatability. Additionally, the model includes a Wafer Handling Equipment that identifies and scans dicing streets for reliable and repeatable placement of wafers at the bonding surface. In addition to its advanced technology, ABC is designed with superior safety features, including a Vacuum Interlock system that isolates the bond chamber for additional safety and protection. The unit also includes a built-in FireGuard smoke detection machine to reduce the risk of fire incidents caused by bond deposits or other ignition sources. For optimal performance, KARL SUSS / MICROTEC ABC is backed by expert service and support from MICROTEC. With an extensive parts inventory, the staff is well-equipped to provide quick and reliable service to keep the tool running at top performance.