Used KARL SUSS / MICROTEC CB200M #9272886 for sale
URL successfully copied!
Tap to zoom
ID: 9272886
Wafer Size: 8
Vintage: 2012
Wafer bonder, 8"
Process chamber
Transfer unit
Bond force up to 90 kN
2012 vintage.
KARL SUSS / MICROTEC CB200M is a dedicated bonder for microfabrication. It is built for the low-volume production of medical and electronic devices needing bonding techniques such as die bonding, die attach, wire bonding, chip attach, wafer bonding, encapsulation, and hermetic packaging. MICROTEC CB200M has a sleek design, making it the perfect choice for high precision bonding. It features a non-contact optical microscope with integrated laser alignment, a camera equipment, and a 15-inch touchscreen color monitor. It is made of high quality components and contains a full-featured user-friendly control system. KARL SUSS CB-200 M has four independently controlled thermocouples allowing for accurate temperature control. This enables precise heat transfer to maximize efficiency without sacrificing quality. It also has a compact frame and foot print that allow for easy use in confined spaces. CB200M uses programmable heaters for precise temperature control and uniform heat distribution across the operator's screen. The interface is designed for easy operation and can be used with many production software programs. CB-200 M offers a range of bonding techniques, utilizing several ultrasonic and thermocompression bonding technologies. These include thermosonic sniffing pulse, thermosonic hand-wrought, and thermocompression (KIE variety) bonding. KARL SUSS / MICROTEC CB-200 M is equipped with an automated die bonder capable of handling up to 16 lead frames at a time, a semi-automated wirebonder for manual and automated wire bonding, an aluminum epoxy dispenser for encapsulating the package, and a manual die-attach unit. KARL SUSS CB200M is manufactured in a way that promotes efficiency. It has quick-set foot pedestals designed to make setup and loading of your bonding job quick and easy. It also has a permanent thermal memory machine storing pre-programmed hotkey operation modes to boost running speed and memory feature. To ensure reliable performance, MICROTEC CB-200 M is equipped with a fail-safe vacuum tool to prevent debris from interfering with the bonds. The asset has a temperature calibration feature to ensure precise temperature readings. It also features powerful cooling fans to prevent thermal hot spots. In conclusion, KARL SUSS / MICROTEC CB200M dedicated bonder is an ideal solution for producing medical and electronic devices in low to mid-volume production runs. It offers precision, speed, and reliability with its wide range of bonding techniques, programmable heaters, and automated die bonder.
There are no reviews yet