Used KARL SUSS / MICROTEC CBC200 #9229463 for sale

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Manufacturer
KARL SUSS / MICROTEC
Model
CBC200
ID: 9229463
Wafer Size: 8"
Vintage: 2006
Auto bonder, 8" For advanced MEMS Manufacturing and 3D Wafer bonding 2006 vintage.
KARL SUSS / MICROTEC CBC200 is a high-end precision bonder that is ideal for applications requiring reliable and repeatable contacts on a wide variety of Au, Cu, and specialty wires and components. MICROTEC CBC-200 is capable of providing reliable, repeatable contact dominance in a full range of bond sizes from 150 µm to 510 µm (6mil to 20mil). The bonder features both force-controlled and force-limited bonding technology. The force-controlled technology ensures a high-quality of bond reliability and repeatability of the bond size and temperature, while the force-limited technology provides secure contact dominance and reduces the risk of soldering at excessive temperatures. KARL SUSS CBC 200 is compatible with microbonds, which are highly accurate contact points that have a pitch of less than 0.2mm and require a low level of contact force. These contacts require a high level of accuracy and for CBC 200 to be successful in this application, a very tight pitch accuracy and a repeatable bond size are achieved. CBC-200 is also capable of bonding ball-grid arrays (BGA) with a targeted bond size of 310 µm (12mil). This allows manufacturers to reduce costs associated with large-pitch BGAs and provides high-end precision for both machine and contract assembly. It also features an advanced ball-weld technology, which combines a linear motion system with a continuous loop contratrol in order to minimize bond size variability, resulting in a more reliable and repeatable bond. MICROTEC CBC 200 is equipped with error correction and cycle tracking systems that help ensure a repeatable and consistent bond. These systems are designed to recognize the point at which contact is made, the deformation of the bond, and potential process failures. Finally, CBC200 includes a range of safety features including automated process deviation detection, in addition an electromagnetic compatibility certified that ensure compliance with pertinent safety regulations. This ensures a safe and reliable bond with minimal risk. Overall, MICROTEC CBC200 is an excellent choice of high-end precision bonder. It is capable of making repeatable and reliable bonds on a wide variety of Au, Cu, and specialty wires and components. This makes it suitable for a range of applications and ensures a safe and reliable bond with minimal risk.
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