Used KARL SUSS / MICROTEC CBC200 #9272896 for sale
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ID: 9272896
Wafer Size: 8
Vintage: 2013
Wafer bonder, 8"
Cluster frame
(4) Process modules
Transfer unit
Pre-aligner
2013 vintage.
KARL SUSS / MICROTEC CBC200 is a precision bonding station that is typically used for advanced microstructuring applications such as flip-chip, optical, and die-level packaging. MICROTEC CBC-200 is capable of placing micron-level accuracy components with precision down to 0.1 microns. It is equipped with a dual heating stage, which provides a fast and precise temperature profile for an optimized cure process. KARL SUSS CBC 200 also features a patented "force-closed" bonding method which ensures a precise and reliable bond. The station also has a high resolution vision system which allows the user to accurately inspect the bond quality on small components. MICROTEC CBC200 has a small footprint which makes it easy to integrate with other machines and systems in the manufacturing line. Additionally, it is equipped with a user-friendly interface that minimizes the time needed for setup and operation. CBC 200 also has automated and manual control functions so users can easily customize the bonding process. Furthermore, the station has an embedded system which provides diagnostics to troubleshoot problems. KARL SUSS / MICROTEC CBC 200 also features a high vacuum chuck for advanced processes such as smart bonding and solder reflow. Overall, KARL SUSS CBC-200 is an excellent precision bonding station that is highly accurate, reliable, and easy to use. The station is ideal for advanced microstructuring applications such as flip-chip, optical, and die-level packaging. It also has a small footprint and user-friendly interface to make setup and operation easier. Finally, MICROTEC CBC 200 has a high vacuum chuck for advanced processes which is a valuable addition for many applications.
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