Used KARL SUSS / MICROTEC SB 6 Vac #293585733 for sale

ID: 293585733
Wafer bonder, parts system With VARIAN Turbo-V70 Vacuum pump and controller BERTAN 206B High voltage power supply BALZERS SingleGauge Vacuum gauge Computer missing.
KARL SUSS / MICROTEC SB 6 Vac is a powerful, medium-sized semiconductor bonder designed to facilitate the direct-bonds of all types of semiconductor and optoelectronic components. MICROTEC SB 6 Vac is capable of efficiently and accurately performing continuous-feed and manual-feed processes, with a maximum bond area of 6 square millimeters (mm2) and a minimum bond area of 3 mm2. The machine utilizes optical imaging sensors, vision processing systems, and target-based collision avoidance technology in order to precisely handles small batches of semiconductor chips, wafers and substrates. The optics mounted on KARL SUSS SB6 VAC can also be used for bond verification and alignment. In terms of accuracy, SB 6 Vac is capable of achieving a vertical resolution of 0.025 mm and an accuracy of ±0.01 mm in the XY-axis. Additionally, the adjustable pressure up to 100 bar provides reliable adherence of the substrates, along with reduced voids and chipings. KARL SUSS SB 6 Vac is intuitive, allowing operators of any skill level to enter parameters into their user-friendly interface while a process is active or in standby mode. This enables users to quickly create and edit job recipes, heat profiles, and process parameters. The system provides users with long-term uptime, as it features an efficient five-axis robotic arm which allows for a wide range of movements. In addition, the system utilizes a quick wafer shuttle which is compatible with various platforms and wafer sizes, from 100mm wafers up to 200mm wafers. KARL SUSS / MICROTEC SB6 VAC comes equipped with a variety of safety features such as laser safety functions, safety interlocks for the enclosures, and comprehensive operator safety standards. This ensures the integrity the operator and the equipment. Overall, SB6 VAC is a lightweight, efficient and highly accurate semiconductor bonding platform. MICROTEC SB6 VAC's wide range of motion and high accuracy makes it suitable for performing a variety of precision bonding applications. Besides, its user-friendly design makes it ideal for both inexperienced and experienced users alike.
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