Used KARL SUSS / MICROTEC SB 6 #293590916 for sale

KARL SUSS / MICROTEC SB 6 is a thermal and UV semiconductor bonder designed for microelectronic and optoelectronic applications. This reliable and affordable bonder is used for a variety of applications, such as leading bond wire, ball bonding, wedge bonding, and die attach. MICROTEC SB 6 is powered by a 6 inch double field flat panel display that makes it easy to clearly monitor the bonding process. The equipment is capable of closing the lid quickly and efficiently using an integrative cover system and has a fast polarity exchange time. KARL SUSS SB6 bonder is equipped with multiple tooling functionalities such as vacuum, ultrasonic, and infrared spot welders. This unit also comes with a variety of automatic functions that simplify the bonding process such as: automatic edge alignment, quick reflow of ultrasonic and ball bonds, and an accuracy control machine. In addition to this, KARL SUSS / MICROTEC SB6 features an advanced positioning tool for accurate alignment and repeatable positioning for precise bondability. The asset has a wide range of bonding capabilities with its powerful motion control model and potential for the temperature up to 220°C. MICROTEC SB6 is capable of accommodating a variety of materials including gold, aluminum, alumina, stailsil, and sapphire. It has full electrical safety design and is able to detect and rejects false signals. SB6 has fast loading/unload time, 12 frames/second process speed, fast pneumatic control, and precise temperature and current control. With its integrated vacuum measurement device, it is able to precisely measure bond strengths. SB 6 is equipped with a user-friendly interface and software to make it simple to operate and easily compatible with its accessories. It also has an advanced monitoring equipment to keep track of bonder temperatures, parameters, current, and more. KARL SUSS SB 6 is a reliable, accurate and affordable bonder that meets the demands of various bonding applications. It is easy to use and offers multiple tooling functionalities and many automatic functions that increase productivity. The system has a large variety of bond-wire, ball bonding and die attach capabilities, making it a great choice for those who are looking for a reliable, high performance bonder.