Used KARL SUSS / MICROTEC SB 6 #9223423 for sale

KARL SUSS / MICROTEC SB 6 is a state-of-the-art bonder specifically designed for assembling micron-level components. It is a full-fledged ultra-precise Nano Positioning Bonding Equipment with active control of the bonded elements. MICROTEC SB 6 offers extraordinary performance and user-friendly features for a wide range of applications such as die and flip-chip bonding, as well as rework and inspection. The high precision of KARL SUSS SB6 is possible due to its closed-loop motion system, which enables precise force control. It consists of two axes (X and Y) and provides several features that help move and bond devices with high accuracy. The AutoVision unit allows for accurate placement of the components while the automated two-point alignment offers reliable stability. The active force control ensures that the components are securely bonded regardless of any external disturbances. In addition, KARL SUSS / MICROTEC SB6 comes with advanced interconnect technology such as thermocompression, thermocompression ligament, thermocompression vertical, and thermocompression Sidetip. SB 6 also comes with a visual control machine to ensure that the bonding process is accurate. This tool allows the operator to view and verify the position of the components under high magnification. The advanced in-depth analysis software has been designed to detect any deviations from the original design layout and provides instant feedback to the operator. Furthermore, MICROTEC SB6 offers an intuitive and user-friendly interface which makes it easy to operate. The intuitive touch screen is used for displaying the data related to the bonding process. Additionally, the software provides automated process optimization capabilities. This feature makes it easy to adapt the asset to various process conditions while ensuring quality and precise results each time. Overall, SB6 is an excellent bonding model that provides superior performance and accuracy for micron-level components. Its user-friendly interface, advanced motion equipment, and automated process optimization capabilities make it an ideal choice for a wide range of bonding applications.