Used KARL SUSS / MICROTEC SB 6 #9256103 for sale

KARL SUSS / MICROTEC SB 6 is a micro-pattern equipment and a die bonder. It is used to assemble semiconductor Dice, micro- electronic components and connectors, and flip-chip chips. It is capable of high precision micro- soldering, die bonding, and post-processing operations. The die bonder is equipped with eight robots: two manual robots, two standard die bonder robots, three fine placement robots, and one cutting robot. The robots provide precise and repeatable motions for automated die bonding and post-processing processes. The manual robots are for manual die bonding, pick-and-place manipulation, and operator functions. The die bonder robots are for die bonding, post-processing, and other operations. The fine placement robots perform the Fine Pitch Placement of chip-on-chip modules. The machine also has a Die Setup software suite to manage die placement, bonding, and other parameters. This software allows users to create and optimize recipes for various micro-soldering and die bonding applications. The software is also used to calibrate the robots, monitor and control the precision of the machine, and set up new parameters to increase efficiency. MICROTEC SB 6 utilizes a vacuum suction equipment to hold onto the micro-components and chips in place during operations. This system uses high-precision sensors to ensure the accuracy of the operations. Additionally, the unit comes equipped with a LED microscope, so that users can monitor the progress of die bonding and post-processing processes. KARL SUSS SB6 also has a cooling station for checking the temperature of the components before, during, and after the assembly process. This ensures that thermal stresses don't damage the micro-components and chips. Additionally, the machine is equipped with a Security Access Point (SAP) for activation and deactivation of sensors, alarms, and other machine controls. SB6 is designed for high productivity and maximum performance. It is capable of operating at speed up to 60 ppm and performs with dynamic accuracy of 10 um. This makes it ideal for production of medical, automotive, and telecommunications applications, among others. It has some of the most advanced technology in the industry and its use can lead to major cost savings and improved product reliability.