Used KARL SUSS / MICROTEC SB 6e #293590404 for sale

KARL SUSS / MICROTEC SB 6e is a fully automated bonder designed for research and development projects in the semiconductor industry. The bonder is designed to make high quality, repeatable and reliable bonding of different substrates to other components, including wafers, substrates, and chips. It utilizes a variety of techniques including die attach, wire bonding and flip chip bonding to ensure the best quality bond. MICROTEC SB6E is powered by MICROTEC advanced SUSS BA bonding platform, which provides the flexibility to program and automate the settings for multiple applications. This platform provides the highest level of closed loop control and accuracy while bonding, and increases process repeatability. It is also capable of working in both die attach and wire bonding modes with a simple parameter setting, without the need for manual calibration. KARL SUSS SB 6 E includes many features, such as servo driven XYZ motion, bridge control, advanced vision equipment, auto centering, and auto alignment for a variety of differing substrates. It is equipped with advanced heaters designed for enhanced heating, as well as a vacuum system which facilitates increased die attach cycle time. The bonder also offers a wide variety of tools which allow users to experiment with various processes and materials. KARL SUSS / MICROTEC SB6E's easy-to-use programming interface enables users to quickly and easily set up and execute robust processes. This can be done through the multi-line and multi-languages graphical commands which allow for the parameterization of almost any sequence. The intuitive programming and documentation library also makes it easy for operators to quickly configure the parameters that are necessary for specific substrate and application combinations. KARL SUSS SB6E also has an integrated capillary unit that is capable of producing bonding wires with a high degree of repeatability. The integrated vision machine enables the detection of potential defects in the bonding process and can eliminate potentially defective wires. SB6E is the perfect solution for any research or development project using substrates that require bonding. Its advanced collaboration of features and capabilities make it easy to accomplish any task while leveraging the highest level of process repeatability and accuracy. With its user-oriented programming interface, advanced vision tool, and integrated capillary asset, it ensures reliable bonds and high yield products that meet the most stringent expectations.