Used KARL SUSS / MICROTEC SB 8e #293609336 for sale

KARL SUSS / MICROTEC SB 8e is an advanced, semi-automated manual bonding equipment that is perfect for microelectronic component manufacturing and subassembly. The system features a two-pocket window display and two separate reflow ovens for maximum efficiency. This allows for a number of different processes including fine-pitch component placement, die attach, flip-chip attach and LED attach. The unit is ideally suited for 0.15mm pitch and below as it offers a variety of unique features. The two reflow ovens allow for simultaneous curing and measurement of bond strength. The standard operating temperature range is from room temperature up to 250°C. The substrate temperature is controlled, meaning the entire machine maintains a consistent temperature. The bonder is equipped with a separate bonder head to handle the more intricate touch-down and pickup applications. In addition, the tool utilises a wide range of three-dimensional x, y, z positioning capability. This allows for precise component positioning and adhesive application. The asset also features a bonding pedantry arm as well as a dynamic vision model. The equipment offers automated alignment, vision-based component recognition, and built in pre-programmed vision tasks. It also supports a variety of manual tasks such as viewing and manipulating 3D die scans. MICROTEC SB8E is certified for cleanroom use. It is also equipped with several programmable modes for processing up to 1,200 bonded devices per hour. In addition, the system includes a safety feature that automatically shuts down the unit if an error is detected. The machine also features over 40 different input, output and process checkpoints to guarantee a successful process. With KARL SUSS SB 8 E, you are getting one of the most powerful and efficient manual bonding systems available. The tool offers highly accurate and repeatable results, more versatile process control, and improved production efficiency. Together these features make for a powerful, reliable and cost-effective bonding solution.