Used KARL SUSS / MICROTEC SB 8e #293619906 for sale

Manufacturer
KARL SUSS / MICROTEC
Model
SB 8e
ID: 293619906
Bonder.
KARL SUSS / MICROTEC SB 8e is an advanced multi-function bonder equipment designed to provide an accurate, reliable and repeatable process for surface mount device (SMD) attachment. This 3-installation system is capable of handling both SMD and surface mount technology (SMT) components. The unit is equipped with an automated die bonder component as well as an optional component counter machine. The automated die bonder uses a patented dot matrix application which ensures that all SMDs are aligned and then dispensed within a few microns of the desired bond point. This ensures a very precise and on-point performance that yields reliable and consistent results. MICROTEC SB8E has a robust mechanical design that provides a very user-friendly interface. It is equipped with a strong structural frame to provide a solid and stable platform for component placement. This model also features an advanced feedback control tool that helps to regulate and monitor the bonder's performance. KARL SUSS SB 8 E uses an advanced pneumatically driven asset that allows for precise motion control. This model also features an integrated vision model which provides an accurate and repeatable auto-focusing and imaging process. The equipment is also designed with user-friendly operation in mind. SB8E utilizes a programmable operating system that makes it easy to access and operate the bonder. MICROTEC SB 8e also provides a wide range of accessories that make it even easier to use. These include automated fiducial recognition and various other camera-based systems that allow for easy alignment and quality control. SB 8e is an ideal choice for high precision and technology-driven SMD and SMT assembly requirements. The use of advanced technologies and an intuitive design make this bonder suitable for almost any size of production facility. Thanks to its robust mechanical design and an array of advanced features, this bonder unit offers an efficient and cost-effective solution for high volume SMD assembly.
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