Used KARL SUSS / MICROTEC SB 8e #293762322 for sale

Manufacturer
KARL SUSS / MICROTEC
Model
SB 8e
ID: 293762322
Vintage: 2007
Bonder XDS-10C Dry pump Chuck table: Silicon carbide, 8" 2007 vintage.
KARL SUSS / MICROTEC SB 8e bonder is a fully automated die bonder specifically designed for use in manufacturing and research environments. With its 8-axis movement, programmable aperture and motorized camera system, this bonder enables precise and repeatable die attachment, wire bonding, and other similar processes. The bonder is equipped with two precision alignment stages, which can be manually adjusted or configured to work automatically. This provides very accurate and repeatable placement, ensuring that the die attachment is exact each and every time. The motorized camera system allows for magnification, contrast and focus control for maximum repeatability in die attachment. The bonder also utilizes a wide variety of bonding techniques, allowing users to bond all sorts of substrates. This includes fine-pitch and bump bonds, along with wide-pitch and stud bonds. Additionally, the bonder also enables flip-chip bonding with an optional flip-chip station. All of this technology is made further accessible with a user-friendly interface, making it easy to operate the machine. The bonder also features a reversible hot compensation feature, allowing it to easily adjust to changing environmental conditions, maintaining an ideal and consistent temperature throughout the process. This provides a high level of temperature stability and helps eliminate the risk of accidental overheating. MICROTEC SB8E is also equipped with safety features to protect both the user and the process. This includes a rotary interlock, which is a physical barrier that engages when the transformer is accessed, restricting access unless the transformer is deactivated. This helps ensure that the diegaze is not exposed to potentially damaging temperatures. Overall, KARL SUSS SB 8 E bonder is an incredibly advanced and reliable machine designed for a wide variety of applications. With features such as precise and repeatable die placement, a wide range of bonding techniques and safety features, this die bonder is a perfect fit for any manufacturing or research setting.
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