Used KARL SUSS / MICROTEC SB 8e #293762324 for sale

KARL SUSS / MICROTEC SB 8e bonder is a state of the art desktop substrate bonder used for chip-on-board assembly and die attach. This equipment is designed to provide users with complete flexibility, accuracy, and repeatability. It can be used for die bond applications ranging from automated teaching and production, manual placement, fine-pitch flip chip and BGA applications. MICROTEC SB8E offers a unique, groundbreaking design that allows for assembly of single-die devices with high-precision placement in as small as 100 µm pitches and ultra-thin die down to 10µm. The system makes use of a CCD camera and internal optics that are configured for aberration correction to accurately determine the placement location and height of the die. This enables it to perform die attach down to 0.0625 mils accuracy and down to 8 mils pitch at up to 150 GHz II repeatability. In addition, the bond head has a built-in closed-loop unit for accurate and repeatable bond force control. The machine also features a mini spot application head for use in tin-lead soldering and flux application. The hardened ceramic dispense head is configured for repeatable accuracy and adjustable enrichment of 1:3 - 1:5 for tin-lead soldering. For automatic dispensation, the head is equipped with a high tech, encoder-controlled, motorized X-Y table and rotating valve mechanism. For overall tool automation, KARL SUSS SB 8 E offers a foot pedal and push button operation in order to start and stop the alignment sequence as well as to start and stop substrate motion and pressure sensing. Through a graphical user interface the asset also offers 12 dedicated program memories for custom recipes and storage of process parameters. Furthermore, the model also offers a built-in diagnostic tool and various RS232C interfaces for equipment integration and connection to a computer. In conclusion, KARL SUSS SB8E is a highly accurate and reliable substrate bonder ideal for automated and manual die attach applications. It is a cost-effective solution providing ample flexibility and precision for various chip-on-board assembly and die attach processes.