Used KARL SUSS / MICROTEC SB 8e #293815721 for sale

KARL SUSS / MICROTEC SB 8e is a fully automated, multi-functional, medium-scale die bonder. It is equipped with a fully automated vision system to ensure precise placement of the die to the substrate and its corresponding wire bonding processes. This bonder utilizes two wire bond heads that can be changed between ultrasonic and thermocompression. The bonder also has a fully integrated heating stage with an adjustable temperature range up to 400°C to ensure efficient and reliable bonding. MICROTEC SB8E offers a very large working platform (195 x 145 mm) and an adjustable bond head height (up to 60 mm). This feature makes it suitable for different package types and application variations. The low power consumption (300W) makes it easy to use and cost effective while providing a reliable and accurate bonding process. The bonder also features an automatic solder fluxing application as well as the option to incorporate additional wire bonding techniques such as gold or silver wire bonding. The bonder is also equipped with an adjustable wafer chuck and vacuum cleaning system for precise placement of the die to the substrate. It can also be configured for different power supplies up to 3000V. Overall, KARL SUSS SB 8 E bonder is a powerful bonding machine with advanced features, suitable for a wide variety of applications in the semiconductor industry. The bonder can be used for prototyping, wafer level packaging (WLP), and low- to high-volume production. Thanks to its user-friendly design, intuitive interface, and robust construction, the bonder is a reliable tool for automated die attach processes and wire bond applications.