Used KARL SUSS / MICROTEC SB 8e #9212773 for sale

Wafer bonder P/N: 100059734 Bonding of aligned substrates: 4"-8" in diameter Base machine specifications: Aligned wafer transport fixture: Manual loading / Unloading Automatic process data recording with selectable interval Polished stainless steel cabinet Motorized Z axis for automated wafer stack thickness compensation Transport fixture loading slide Process chamber: Electro polished process bond chamber with controllable insertion of process gases Automated open / Close process chamber door with integrated safety light barrier (VAT door) Automatic chamber purge during process door cycling to avoid chamber Media supplies: Clean dry air: 6 Bar Process nitrogen: 7 – 75 Bar Vacuum 100 mbar (abs) for pressure bond tools Control system: User & maintenance interface Operating system: Windows Network connection: Ethernet External communication: USB Connection PC Flat panel monitor with keyboard and trackball Hot chuck(s) SB8 GEN2 with industrial temperature controller Industrial temperature controller for enhanced precision temperature control Rapid setup of temperature ramps with fast controller profiling & control of heaters Lower hot bond chuck with temperature control from ambient to 500°C Resistive heater with active air cooling Temperature control: +/- 3 degrees Programmable temperature ramps Temperature uniformity: +/- 2.0% Heating / Cooling performance: Heating: 30°C /min Cooling up to 28°C/min machine and configuration depending Kit, upstream control: For bonding from atmospheric pressure down to of 5e-5m bar with turbo pump option Downstream controller: Pressure range: Absolute 1 - 1000 mbar up to 3000mbar with over pressure kit option Flow between 05 & 13 l/min (Depending on pressure) adjustable by manual valve Signal status tower: P/N: 100075936SB Light tower with three lights & buzzer for machine status indication Lights configured & customized Multiple process gases kit: P/N: 100059766 Automated gas selection for up to 4 process gases (N2 Plus three gases) Recipe controlled automated selection of one of four process gases Configurable process gas names Supports all inert gases Forming gas with a maximum concentration of 5% & synthetic Air (80%N2 20%O2) Clean PFA teflon process gas tubing Turbo pump with scroll pump: P/N: 100059752 For high vacuum to 5e-5mbar Turbo molecular pump Scroll pump type: EDWARDS XDS Dry lubricant free Chemically resistant Clamp / Spacer unit with sequential spacer removal: P/N: 100060409 Hardware & software for individual spacer removal & clamp arm control Options: Bonder to lift one clamp Spacer force free and to set the clamp again Programmable actuation, improves post bond alignment capability Standard tool force generation: P/N: 100059765 Option: Bonder to control the bond force via cascaded two point control system Bond force values: Minimum force: 300N Maximum force: 20kN Maximum ramp rate: Up to 3.7kN/min P/N: QW1001312 Force range capability 500N - 20kN with 6" / 8" wafer Spring loaded center pin: Diameter 12mm Heater temperature range: Ambient plus 10°C up to 500°C P/N: W1002902 SiC Pressure plate and sandwich plate(upper & lower): 8", Diameter Pressure plate: (3) Cut outs for spacers and clamps P/N: W1023794 Compatible with SUSS MicroTec bond aligners, for 8" wafers Clamp arms included P/N: W1026899 TiN Coated stainless steel: 0.2 mm thick Power requirements: 380-400 VAC, 20 A, 50 Hz 200-208 VAC, 25 A, 50/60 Hz.