Used KARL SUSS / MICROTEC XBC300 #9360798 for sale

KARL SUSS / MICROTEC XBC300 is a high-precision, automated bonding equipment specifically designed for low cost, high volume chip-to-chip or chip-to-substrate applications. This automated bonding system is capable of delivering excellent bonding results on a wide range of materials including but not limited to gold, aluminum, copper, steel, and other conductive materials. MICROTEC XBC300 has a highly modular design that enables easy customization of the unit to meet the needs of any application. The main components of the machine that make up the automated bonder include a rigid frame, a control unit, and a substrate holder. The frame of the tool is made of high-grade aluminum and is fitted with a vacuum pump, a laser diode, and a high resolution camera to ensure accuracy during the bonding process. The control unit of the bonder can be connected to a personal computer for greater flexibility and control. The control unit is capable of controlling up to four application programs, motion sequences, temperature cycles, and other related parameters. The substrate holder is designed to accurately positions the substrate against the bonding head and provides precise control of the position of the substrate. KARL SUSS XBC 300 is capable of both wire and wedge bonding applications and is compatible on a broad range of materials including Polyimide, Silicon, Leadframes, and other materials. The bond head provides up to 5-micron resolution with maximum accuracy that is required for high volume processes. The wire bonder also supports the automated placement of chips onto substrates, which is done using an automated pick and place asset. This model is capable of achieving high placement accuracy at high speeds making it ideal for high-volume applications. The equipment is also capable of die bonding, which is the process of bonding a die directly to a substrate. KARL SUSS XBC300 is specifically designed for low-cost, high-volume chip-to-substrate and chip-to-chip applications. This bonder is equipped with a variety of accessories to ensure accurate, reliable performance. These accessories include a bath, a wire linker, and a specialized bonder gun. More importantly, XBC300 comes pre-calibrated and is easy to install. Overall, KARL SUSS / MICROTEC XBC 300 is an effective and reliable automated system offering highly reliable results.