Used KELLER TECHNOLOGY Bond Test 30 #197770 for sale

KELLER TECHNOLOGY Bond Test 30 Bonder is a automated bonding equipment designed for precision bonding of copper, aluminum and other alloy wire harness components. Bond Test 30 is built for high-volume production lines as its quick bonding cycle time speeds up the entire process. KELLER TECHNOLOGY Bond Test 30 has a rigid machine frame and is constructed using high-grade aluminum components, providing weight and durability. The bonding process is regulated by three independent controllers - one for each of the three stages of the process. This allows Bond Test 30 to consistently produce repeatable and secure bonds. KELLER TECHNOLOGY Bond Test 30 Bonder features a polyurethane pressing system and vertical alignment device which ensures that each joint is accurately aligned, and that wires are tightly secured during the bonding process. The polyurethane provides superior protection against possible wire slippage, ensuring that a secure bond is achieved. Additionally, the polyurethane pressing unit offers superior insulation to protect against shorts and corrosion. The operating temperature of Bond Test 30 Bonder can be adjusted to accommodate various types of wire, providing additional control for high precision jobs. Additionally, KELLER TECHNOLOGY Bond Test 30 also features variable power output, adjustable from mini hertz to mega hertz, and current output from micro amperes to milli amperes. This versatility gives Bond Test 30 an advantage over other automated bonders in the market. KELLER TECHNOLOGY Bond Test 30 Bonder is equipped with a high-speed data acquisition machine that monitors the entire bonding process and records the results. This gives users the ability to inspect, review and track changes in the bonding process and make necessary adjustments. The user-friendly interface allows for quick and easy setup, providing an efficient and reliable bonding environment. Overall, Bond Test 30 Bonder is an ideal solution for businesses needing reliable and secure automated wire bonding. KELLER TECHNOLOGY Bond Test 30's multiple controllers, adjustable temperatures, and variable power output ensures precision and accuracy, making it ideal for small to medium production runs. Bond Test 30 also features a high speed data acquisition tool and user-friendly interface, providing users with a convenient, productive and safe bonding environment.