Used KOREA SEMI CONDUCTOR FXB-100 #9251954 for sale

Korea Semiconductor KOREA SEMI CONDUCTOR FXB-100 is a state-of-the-art wire bonder designed for increasing production efficiency while maintaining excellent bond quality. FXB-100 is designed to accommodate a large number of applications, from the lastest E/E and RF technologies to the most advanced solder ball and flip chip bonding. With its high bond force, high speed, and easy operation, KOREA SEMI CONDUCTOR FXB-100 is ideal for manufacturers who value quality and efficiency. FXB-100 features two high-powered precision-controlled motors providing precise, reliable bond force and speed for all bond lengths. The machine utilizes an extra-long guide bar which provides an extra force of 1.2kgf to maintain a consistently high bond force with every bond. This allows for faster and more reliable wire bonding of a variety of materials, which can reduce costly bond defects. KOREA SEMI CONDUCTOR FXB-100 also features an intuitive and easy to use human-machine interface (HMI) that gives the operator total control over the entire wire bonding sequence. The HMI allows for several levels of programming, allowing the machine to be easily tailored to meet the most challenging application requirements. It also features a full range of diagnostic functions, an auto-calibration equipment, and several memory functions for easy access to previously used bond parameters. FXB-100 includes both an active and passive sub-assembly platform for more efficient wire bonding of dual-sport packages. This platform allows for very precise handling of die height and board tolerances, minimizing bond length variation. The platform is also very flexible, allowing for custom programming and layouts to meet the exact needs of the user. Finally, KOREA SEMI CONDUCTOR FXB-100 includes an automatic bond length detection system that is designed to detect and gauge bond lengths quickly and accurately, ensuring perfect bond lengths time after time. This unit is capable of detecting bond lengths in increments of 0.00001", making it perfect for ultra-high quality and repeatable bond length control. The Korea Semiconductor FXB-100 is an impressive, high-quality wire bonder that offers increased speed, precision, and control for increased production efficiency and quality. Its robust build and accurate bond length detection machine make it ideal for many different applications, making it an excellent choice for any manufacturer looking for a reliable and efficient wire bonding solution.