Used KOSES KUM100 #293619397 for sale

KOSES KUM100 is a polyolefin based butt welding bonding system designed for use in microelectronic device packaging, semiconductor die attaches and other related microelectronic assemblies. KUM100 consists of a bonding layer consisting of polyolefin, such as polyolefin-based polyethylene sheath, and a VHB adhesive on one side of the bonding layer. The bonding layer provides many advantages over other bonding systems including excellent wearability, high thermal and electrical conductivity, and high adhesion strength. The bonding layer is made up of various materials, usually polyethylene, to form a readily bondable film that thermal welds two materials together. The polyethylene sheath provides a stable and conductive surface for the two pieces of material that need to be joined. By using the polyethylene, the bonding layer provides long-lasting electrical and thermal conductivity, even in extreme temperatures. The polyolefin is also highly durable, withstanding high impact and pressure. The VHB adhesive is used to adhere the polyethylene on one side of the bonding layer to the base material that needs to be welded. This adhesive provides high adhesion strength to the polyethylene, making sure it will not become detached in extreme temperatures. The VHB adhesive is also resistant to solvents and chemical leakage, making sure the attached base material is always secure and will adhere correctly to the polyethylene. KOSES KUM100 has been tested and proven to provide quick and reliable bonding processes in applications where high temperatures, extreme pressure and impact resistance are demanded. The ease of the welding process for long-lasting electrical and thermal conductivity makes this an excellent choice for microelectronic device packaging, die attach, and other microelectronic assembly. KUM100 is an all-in-one solution for microelectronic package assembly and die attach, providing a high quality bond for a range of applications.