Used KULICKE & SOFFA 1448 #9163808 for sale

KULICKE & SOFFA 1448 is an automated die bonder designed for high-volume semiconductor applications. It is versatile enough to be used for a wide variety of packaging techniques. 1448 has a comprehensive suite of process control options. It features a dual-arm robot with an interchangeable bonding head and accompanying software. This allows for various combinations of wire bonding, chip-on-chip bonding, flip-chip bonding, and wafer bump bonding. The efficient design of KULICKE & SOFFA 1448 allows it to be used for multiple applications across a variety of industries. It is compatible with a wide variety of materials and substrates, including ceramic, plastic, and metal. 1448 has a maximum processing area of 200 by 200 mm, and a maximum die size of 11.5 mm with a 0.3 mm pitch. KULICKE & SOFFA 1448 is designed to securely attach die components to substrates with a high degree of accuracy. Its advanced technology includes an intuitive and graphical user interface (GUI) which provides maximum ease of use. The GUI includes representations for each step of the bonding process. The software is designed to maintain a high cycle rate and repeatability. Using 1448, users can choose from a range of process parameters to optimize production volume and quality. Onboard process control options include temperature, speed, and force. The machine is designed with three stages of heated lamps for temperature control which helps optimize the bond strength. Additionally, the software provides visual real-time feedback for process results and output. KULICKE & SOFFA 1448 offers a cost-effective and efficient automated process that can be used in both high-volume and low-volume production. It is suitable for a range of die sizes and bond types. 1448 has an integrated vision system and can be integrated into a variety of existing factory layouts. Its fast cycle speed and repeatable results make it an ideal choice for manufacturers looking to increase their yield and throughput.