Used KULICKE & SOFFA 4124 #293793049 for sale

KULICKE & SOFFA 4124 is a Flip Chip Bonder designed to rapidly prepare, bond, and process both semiconductor and electronic components. This machine is designed to quickly produce reliable electronic assemblies at high densities. 4124 features a high throughput, automatic clamping, and dual bond head capability for bonding two components at a time. The machine comes standard with a variable speed DC motor unit for precise control of bonds. It also features an adjustable height and aligns feature for optimum bond placement. KULICKE & SOFFA 4124 uses two different bond actuators for optimum performance. The vertical actuator provides variable speed bonding and is integrated with a control equipment that allows for pinpoint accuracy in bond placement. The horizontal actuator allows for placement of both components at a fixed height that helps ensure that overall bond placement is accurate. 4124 is also equipped with adjustable focus and magnification for enhanced inspection capabilities. The machine's 3 axis motion system ensures a reliable, repeatable bond for a variety of components. In addition, KULICKE & SOFFA 4124 comes with an onboard data acquisition and analysis unit that provides real time data as well as insights into the operation of the machine. This machine also allows for remote monitoring and troubleshooting. Also included is a self-adaptive adhesive tool which reduces multiple setup steps and cleaning time associated with manual adhesive application. This asset applies the correct amount of adhesive to the surface of each component before bonding and prevents over-application. In addition, 4124 has an integrated vacuum model that ensures even adhesion of components. KULICKE & SOFFA 4124 also features programmable settings that allow for quick turnaround times and maximum efficiency. The operator can program a list of components to run in a single cycle and can simultaneously monitor and control the conditions of each device to individual preferences. The machine also has an auto-release feature that prevents jamming and allows for easy removal of the bonded substrates. 4124 is a versatile and efficient Flip Chip Bonder that provides superior performance and reliability. Its onboard data acquisition and analysis equipment, adjustable focus and magnification, and self-adaptive adhesive system make it an ideal choice for high volume electronics assembly applications.