Used KULICKE & SOFFA 8028WG #293652410 for sale

KULICKE & SOFFA 8028WG is an automated high-precision wire bonding machine designed for the semiconductor industry. It is capable of performing various wire bonding processes at high speed and high accuracy. 8028WG offers precise control over the bond formation process and precise wire alignment. KULICKE & SOFFA 8028WG has a high speed stacked-die alignment equipment that can align stacked ICs and other devices for precise bonding. It features a unique, patented rotary wedge bond head that provides accurate and repeatable alignment for wedge bond applications. This rotary head allows for precise bond placement and alignment angles, which help to ensure reliable bond formation and accurate wire placement. 8028WG also features a high-capacity, high-speed automated oven system that can rapidly process several pieces of large and medium-scale wire bonds in a single cycle. This feature is ideal for industrial applications where large-scale bonding is needed. In addition, KULICKE & SOFFA 8028WG is equipped with a variety of advanced control options, such as servo motors, programmable logic controllers (PLCs), and industrial PCs, allowing for easier and more precise control over the bond formation process. The control unit also enables precise remote monitoring and control over various parameters, such as the speed of the wire bonder, the temperature of the ovens, and the size and number of items to be bonded. 8028WG also has several safety features such as door interlocks, E-stop buttons, and an over-temperature safety machine. These safety systems help to prevent accidents and reduce damage to the wire bonder and its parts. KULICKE & SOFFA 8028WG wire bonder provides excellent performance and high-end features that make it an ideal choice for high-speed, high-accuracy wire bonding. It is well-suited for industrial and production applications that require significant levels of wire bonding accuracy.