Used KULICKE & SOFFA KS-4524 #9144253 for sale

KULICKE & SOFFA KS-4524 is a high performance, integrated precision bonder designed to automate and optimize the most demanding flip chip and lead bond interconnect processes. This advanced bonder features a unique, high force bonding technology with an ultra-precise, motorized pick and place component handler, allowing for fast and accurate component placement and bonding. The machine offers unparalleled flexibility and scalability, with the ability to bond a wide variety of component packages, from small flip chips and single components, to large, multi-component packages. KS-4524 is capable of high-speed operation of up to 8,000 bonds per hour and precise, submicron control, making it an ideal solution for production-based component assembly environments. The machine offers powerful precision positioning capability and precise component handling, both in and out of the bonding process. The machine's multi-axis manipulator allows precise alignment of components prior to bond interconnect, and the top-mounted component handler allows rapid component pick-up and placement within the bonding process. The machine also offers precise and repeatable bond force, temperature and current control parameters. This can provide reliable repeatable results in applications such as eutectic die attach and heavy gold wire bonding. KULICKE & SOFFA KS-4524 is designed to be flexible and has many upgradable options and software packages available, such as vision systems, test systems, wire guides and multi-axis component manipulators. A full range of tooling is also available to suit a variety of application requirements. The machine is serviced on-site by certified technicians, making it easy for customers to get the help they need in order to maintain uptime and product throughput. KS-4524 is a high-end, feature-rich bonder that can provide critical precision to any assembly environment. This machine is suitable for a wide range of production processes and takes advantage of its intuitive user interface, precise control parameters and automated component placement capabilities. It's designed to provide reliable, consistent results and maximize production throughput, making it an ideal solution for high-volume component interconnect processes in a variety of industries.