Used LOGITECH 1WBT2 #293807294 for sale

LOGITECH 1WBT2 is a fully automated die bonder designed for efficient and reliable wire bonding applications. It features an advanced motion control equipment with high accuracy bond positioning, and an intuitive programming interface for easy set-up. 1WBT2 is equipped with a twin-head bonding module, allowing for simultaneous bonding operations. This saves time and money, allowing for quicker production turnaround times. The equipment is designed to provide high yields and accuracy with a range of bonding pad sizes from 0.2 mm to 1.2 mm. It features a three-axis motion system, allowing for simple and accurate bonding of wire connections. The controls can be tailored to the needs of specific products, allowing for repeatable and consistent results. The robust and reliable unit also allows for dual loop wire bonding, providing extra security for high-reliability applications. In addition to its versatile wire bonding capabilities, LOGITECH 1WBT2 also comes with an optional font mask and manual gearbox. The font mask enables automating the picking of the wire bead, while the manual gearbox allows the operator to fine-tune the speed and force of the wire bonding process. This helps to ensure an even, high-quality product with minimal rework needs. 1WBT2 also comes with a vision machine for real-time monitoring of the entire bonding process. The vision tool accurately detects wire length and left beads, as well as wire bridge and solder bridge positions. This ensures a consistent and reliable product. LOGITECH 1WBT2 is designed for easy integration into multi-module line configurations. This allows for efficient, cost-effective automated processes. The operator interface is designed for simple, user-friendly control, allowing for quick setup times and accuracy. The electric and air control valves allow for flexibility and consistent performance between applications. Overall, 1WBT2 is an innovative and cost-effective automated die bonder. Its robust design and intuitive user interface combine to provide efficient and reliable bond production solutions. It boasts an impressive range of adaptability options, allowing for flexibility and accuracy while also reducing material and time costs, making it the perfect choice for modern production lines.