Used LOGITECH 1WBT2 #9009603 for sale

Manufacturer
LOGITECH
Model
1WBT2
ID: 9009603
Wafer Size: 4"
Wafer substrate bonder, 4" Water supply requirement: Mains pressure cold water Pressurized air: Regulated to 2 bar ± 0.2 bar maximum Key features: Automated process cycle minimizes operator input Wafer to support disc parallelism Touch button control of bonding parameter Bubble free bond Power requirements 1: 110 V, 60 A, Single Phase Power requirements 2: 13 A, 1.44 kW, 110 V.
LOGITECH 1WBT2 is a state-of-the-art thermal bonder designed for use in the manufacturing of electronic and electrical materials. This high-tech model combines various heating technologies with powerful precision-mechanical components to enable high durability bonding of thin and fragile materials such as printed circuit boards, thermal insulation materials, heat-shrinkable tubes and electronic device packages. Its adjustable temperature settings range from 250°C to 330°C to allow for a wide range of processes and applications. It is also equipped with a compact design that allows it to be easily used in a wide range of work areas with minimal setup. The thermal bonder also features a smooth flat heating plate for large material surfaces and an adjustable pressure plate for irregularly-shaped workpieces. 1WBT2 is compatible with a variety of adhesives, ranging from traditional epoxy, polyurethane, and hot-melt glues, to thermoplastic polyurethanes, polyimides and polyolefins. These bonds result in a strong, reliable, and consistent adhesion even when exposed to extreme temperatures and corrosive environments. LOGITECH 1WBT2 additionally has a built-in active top-side cooling equipment that prevents operator burns and limits expended energy performance. This feature also helps to reduce power consumption, save on energy costs, and extend machine service life. A powerful fan-assisted forced-air convection system optimizes heat distribution for better bonding of multiple layers and a powerful built-in suction unit helps hold the material firmly in place to increase accuracy and productivity. Along with its stringent safety features, such as a secure interlock guard, this machine ensures higher efficiency and greater safety in the workplace. 1WBT2 thermal bonder is a prime example of innovative engineering designed to serve a variety of industrial needs. From its adjustable temperature settings, active cooling tool, and wide adhesive compatibility, to the powerful suction and convection asset, this model provides reliable, consistent, and high-quality results every time.
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