Used MATTECH WB-L200 #9053218 for sale

MATTECH WB-L200 is an ultra-high temperature and high-quality wire bonding machine. This reliable and versatile machine from MATTECH Inc. is an ideal choice for advanced assembly and packaging applications including high-performance integrated circuits. This machine is designed to meet the stringent requirements of modern wire bonding processes such as gold ball-wedge bonding and gold ribbon bonding. WB-L200 features an extensive range of precision control and advanced tracking and monitoring systems to ensure highly accurate and reliable results. With a solid steel frame and ample bench space, MATTECH WB-L200 allows for easy integration into a variety of production lines and environments. The machine is equipped with a high-precision servo-driven triple bond head which provides precise and repeatable wire looping action. This feature ensures superior bond integrity for critical applications. The machine also includes advanced power monitoring and adjustment capabilities to ensure more reliable and repeatable results over a wide range of parameters. WB-L200 wire bonding machine is equipped with a highly accurate ultrasonic bonder which provides precise and reliable bonding with a variety of materials. This machine also features advanced temperature control capabilities, allowing for temperature regulation while bonding. This machine also includes a unique in-line tension measurement system to ensure accurate initial loop pull forces. This feature helps to reduce bond-site damage and enhance bond durability. MATTECH WB-L200 also includes an easy-to-use operator interface which allows for automated or manual operation of the machine. This interface is designed to improve operator productivity and minimize the learning curve. WB-L200 also includes support for a wide range of wire diameters, allowing for versatile and efficient wire bonding operations. For the highest levels of bond integrity and performance, MATTECH WB-L200 is the ideal choice for a range of advanced assembly and packaging applications. This durable and reliable machine is specifically designed to meet the stringent requirements of modern wire bonding processes. With its accurate servo-driven triple bond head, advanced power monitoring and adjustment capabilities and in-line tension measurement system, WB-L200 ensures precise and repeatable results for critical applications.