Used MECH-EL 827 #9241067 for sale

MECH-EL 827 is a bonder used for precision bonding of electrically conductive and non-conductive substrates, thin films and optical components. It is designed to enable fast and effective bonding of substrates, including optoelectronic and chip on board assemblies, packaging, fluxless soldering, encapsulation and thin film bonding processes. 827 bonder has a variety of features that make it ideal for precision bonding applications. Its compact size and lightweight design makes it easy to transport and take with you on the go. It features an intuitive control panel which allows users to access and control the bonding process with ease. MECH-EL 827 bonder has a precise and adjustable temperature range from 100-500°C and a maximum bond time of 2 seconds, enabling precise and accurate bonding of intricate substrates. 827 bonder also offers ultra-high speed bonding and fast cycle times, making it ideal for applications that require high productivity. It features pinch roller clamping and nonstick coated platens for easy handling of delicate substrates, increasing product quality and improving the bonding process. Its dynamic zoom optics with LED backlight allows users to accurately target and align their substrates for an effective and precise bonding process. MECH-EL 827 bonder also features a HEPA filtration system to provide an excellent level of cleanliness while bonding, resulting in improved consistency and product quality. Its safety features also make the bonder safe and user-friendly. It features a wide range of safety features, including a low temperature lock-out to prevent excessive heating and a day timer to ensure proper active times. It also has an alarm system and emergency shut off switch to protect users from accidental releases of heat during the bonding process. In summary, 827 bonder is a precision bonding tool designed for fast and effective bonding of both electrical and non-electrical substrates. Its intuitive control panel and adjustable temperature range make it perfect for applications requiring precision and accuracy. Its high-speed bonding capabilities and safety features make it an ideal choice for a wide range of precision bonding processes.