Used MECH-EL 907 #9247519 for sale

MECH-EL 907 is a fully automatic, programmable wire bonder that is used for the mass production of integrated circuit (IC) packages. It is a two-head, semi-automatic, high-precision bonder with a very low operator intervention requirement. 907 consists of the bond head, bond head drive, bonder frame, bonder controller, and bonder power supply. The bond head is a high-precision, programmable feeder with accuracy and repeatability in the nanometer range. This allows for precise, automatic placement and bonding of IC leads. The bond head drive controls the bond head to move the bonder to the desired locations on the IC lead. The bonder frame is made of anodized aluminum and provides the support for the bond head, bonder controller, and the feeder. The bonder controller is a programmable, logic-driven device that controls the bonder functions, such as wire feed positioning and bonding operations. The bonder power supply provides the necessary power for the bond head/bonder controller combo. MECH-EL 907 is specifically designed for high-volume chip production. It is capable of performing a wide range of bond processes quickly and with consistent results. It can bond wire sizes ranging from 0.001" to 0.062", and over 400 bonds per hour. The multi-function controller ensures precise, repeatable bonding process performance. The bonder is capable of simultaneously performing four different tasks, such as ball bonding, wedge bonding, epoxy bonding, and encapsulation. 907 also features an automated wire feeder that precisely feeds the wire into the bonder. The wire feeder is equipped with a digital servomotor that provides accurate positioning of the wire. It also offers a wide range of programming features for bonding operations, including lead and wire working parameters, wire spool coordination, laser weld parameters, and process condition settings. MECH-EL 907 is a reliable and repeatable machine, making it ideal for situations where high-volume chip production is required. It is capable of consistently and accurately producing reliable bond connections, making it a reliable workhorse for auto-production engineers and companies in the semiconductor industry.