Used MECH-EL 909 #9242993 for sale
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ID: 9242993
Wire bonder
Includes:
Aluminum wire: 0.7-3 Mil
Wire holder
B&L Optics
Power supply.
MECH-EL 909 is a stand-alone, automatic, and thermal bonder designed for consistent and repeatable downbond applications in Device Packaging and Semiconductor Fabrication. It utilizes a unique combination of thermal and laser technology to achieve optimal heating and cooling requirements for reliable and precise thermal connections. 909 is a versatile tool that can bond to both large and small substrates. Its self-adjusting design provides improved accuracy and repeatability compared to other thermal bonding systems. Its automatic operation allows for easy and efficient customization of the process parameters and its reduced maintenance requirements makes it ideal for high-volume production. MECH-EL 909 uses high power, short-wavelength laser diode technology to produce the required heat quickly and accurately. The laser is focused into a small, semi-focused beam which is then directed onto the bond interface. The laser is designed to provide a uniform, symmetric heat distribution for optimal bond formation. The laser energy is controlled via a programmable, PID temperature controller that continually monitors the temperature of the bond and can be adjusted to provide the best bond quality. The heated bond interface is then cooled down using a Dual-Stage Cooling Equipment. This two-stage system consists of a high-pressure coolant aspirated from the external tank coupled with a liquid nitrogen-cooled evaporator coil. This two-stage cooling unit helps maintain consistency and repeatability of the downbond cycle. The cooling machine also provides an extended bond lifetime and improved device lifetime. 909 incorporates several safety features to ensure a safe and efficient process. It is designed with an automatic door interlock that prevents accidental operator entry during the bonding process. In addition to the temperature monitoring, the unit also utilizes an integrated monitoring tool which detects any anomalies or faults while the process is running. This asset then sends an automated alert to the operator if any safety related issues arise. Overall, MECH-EL 909 is a reliable and flexible bonding tool for high-volume applications. Its compact design, self-adjusting features, and integrated safety features provide a safe and efficient downbond process that can be easily and quickly implemented into existing production processes. In addition, its automated operation and fast thermal cycle time help to optimize process throughput, providing maximum efficiency and throughput.
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