Used MECH-EL 909Z #83547 for sale

MECH-EL 909Z is a precision bonder designed for die-attaching and wire bonding processes in the electronics and semiconductor industry. It is a versatile machine that is capable of handling a wide range of applications including gold ball, wedge and ribbon bonding, along with eutectic die attach, and thermocompression and thermocompression plus die attach. 909Z has a robust XYZ stages with a repeatability of 6µm, allowing it to accurately reach any point on the device. The XYZ stages are driven by Linear Motors providing a high degree of precision and smooth motion, even at high speeds. It has built in vision capabilities and can be equipped with additional tools for inspecting die, wire and package surfaces before bonding. The machine has automatic height adjustment control and is capable of up to 10 degrees of tilt compensation. MECH-EL 909Z is also equipped with a magnetic bond head that actively reduces vibration during the bonding process and ensures a reliable bond. The intelligent dispensing system eliminates the need to manually adjust valves or replace needles and can be used with a variety of dispensing materials. The machine also has a built-in power source providing up to 7.5kW of power during the bonding process, ensuring reliable and consistent results. 909Z also incorporates a sophisticated process control system. The software allows users to program various process parameters including bond force, lot size, temperature and pressure, as well as monitor and adjust parameters as needed to ensure optimal results. The machine has a process control window that displays current process parameters, allowing users to quickly and easily identify any changes that may need to be made. The user interface is intuitive and user friendly, making it easy for operators to use the machine with minimal training. Overall, MECH-EL 909Z is a reliable and precise bonder designed for a wide range of applications. Its robust design, intuitive user interface and process control system make it an ideal solution for high-precision die attach and wire bonding applications in the electronics and semiconductor industry.