Used MEI 1204W #293627278 for sale

MEI 1204W is a precision bonder with a maximum bond size of 12'' x 4'' (305 mm x 102 mm). It is designed for manual production wire and die bonding, as well as multiple connection bonding. 1204W is composed of two main parts: a main body and a control console. The main body of MEI 1204W consists of a Z-Axis drive equipment and a bond head with the X-Y-Z axis. The Z-Axis drive system is responsible for controlling the bond head and its movement. It consists of a motor, two lead-screws, a belt drive, a home base and a vertical linear slide. The main body also includes a semi-automatic bond head that has the ability to move in the X, Y and Z directions. This bond head allows for precise and reliable bonding applications. The bond head can accommodate a variety of bonders, like wire bonders, die bonders and laser marking machines. The control console of 1204W provides the user with visual indicators for the power supply and the operator interface. It features a high-resolution color LCD display that allows for easy setup of parameters and functions. It also has a touch-sensitive pad with 4 programmable buttons for easy operation. The console also includes a bonding mode selector, a operating temperature selector, a timer, a temperature control mode selector, a bond cycle counter, and a memory save/recall feature. MEI 1204W comes with a manual, a power cord, a set of spare parts, a detachable console hot-keys, a bonding platform and 6x probing fixture. It also comes with a special bond head cable and mounting hardware. 1204W is capable of bonding wires up to 4mm in diameter, die up to 0.5mm x 0.25mm, and multiple connections up to 24 pins. It can also be integrated into existing systems with its 24-pin multi-connector and RS-232/RS-485/I2C interfaces. MEI 1204W utilizes a high-efficiency temperature control unit to maintain uniform temperature and pressure for precision bonding applications. It includes a thermocouple temperature sensor that allows for temperature control over a wide range. 1204W also features a dynamic force control machine, which allows for fine-tuning of the bonding force and pressure during the bonding process. This tool also provides the operator with feedback on the performance of the bonder, such as the applied pressure, the bonding time, and other operational details. MEI 1204W is designed to be user-friendly and reliable. All of the components are built with robust, high-quality materials, making it both durable and reliable. The design of 1204W also ensures that it is fast and easy to set up, and that it can be used to achieve precise and reliable bonds quickly.