Used MICROASSEMBLY TECHNOLOGIES / MAT 6400 #9190552 for sale

MICROASSEMBLY TECHNOLOGIES / MAT 6400 from MAT is a fully automated microelectronics assembly and packaging solution for the production of high-performance chips, hybrids, and assemblies. The equipment uses a variety of proprietary technologies like laser direct imaging (LDI), laser beam micromachining (LAM), and 3D printing. The system is ideal for microelectroncs assembly due to its integrated thermal and force management capabilities, allowing for precise bonding and joining operations for fine-pitch components such as microprocessors. MAT 6400's sophisticated imaging and control unit ensures accuracy and repeatability by tracking the component placement during the assembly process. In addition, its laser direct imaging subsystem can accurately imagedetailed designs onto the wafer or substrate, ideal for constructing very small structures such as MEMS. The laser beam micromachining technology is also used to drill holes, cut slots, or engrave patterns into the substrate. MICROASSEMBLY TECHNOLOGIES 6400 features automated tool change technology, allowing for quick and efficient switching from one bonding process to another. The machine is also equipped with advanced robotic manipulation modules, allowing for precise low-force component handling and placement. The unit has a temperature range of up to 400°C, enabling users to bond ultra-fine pitch components with high yields. Moreover, 6400 can also be programmed to bond multiple components giving users limitless possibilities of integrated 3D assemblies. MICROASSEMBLY TECHNOLOGIES / MAT 6400 also comes with a built-in vision tool that enables quality control of all sub-assemblies. It also provides real-time feedback during the assembly process, ensuring precise and reliable operation every time. Overall, MAT 6400 from MICROASSEMBLY TECHNOLOGIES is a powerful and versatile microelectronics assembly and packaging tool that can produce high-performance components with excellent yields. It offers precise temperature and force management capabilities, making it ideal for a wide range of applications.