Used MPP / MICRO POINT PRO i5000D #9275827 for sale

MPP / MICRO POINT PRO i5000D is a fully automated wire bonder designed for the high-volume assembly of microelectronic devices. With its precise wire and die attach capability, MPP i5000D can be used for the attachment of fragile and pitch-limited components, as well as for encapsulation and encapsulation-free processes. MICRO POINT PRO i5000D is capable of handling a wide variety of chip sizes, from small Wafer-Level Chip Scale Packages (WLCSP) to large die, and allows for the attachment of multiple dies simultaneously. I5000D features a highly precise, four-axis motion system with a capability of 40,000 bond points per hour. This system is driven by stepper motors and a fiber-coupled laser beam that follows a precise path over the bond site. The laser beam is used to measure the exact distance between the die and wire in order to accurately gauge the desired amount of pressure needed to make the bond. This bonder features multiple modes of inspection, including optical microscopy, X-ray imaging, and laser profiling. These tools allow for the monitoring of the bonding process by improving the accuracy and quality of the bond. Additionally, MPP / MICRO POINT PRO i5000D is compatible with all standard wire thicknesses and bond lengths, which ensures a reliable connection. This bonder also features programmable settings that control parameters such as wire feed speed, drive force, and wire-tip tail length. MPP i5000D is designed with an expansive suite of safety features that ensures a safe working environment for the operator. Specialized arc suppression and current monitoring systems are integrated into the machine, which keep static discharge and interference minimized. In addition to this, the bonder is equipped with dual redundant safety systems that monitor pressure and current, which will immediately shut down the machine if pressure exceeds pre-set boundaries or if there is an unexpected power outage. Overall, MICRO POINT PRO i5000D is a reliable, efficient, and highly accurate wire bonder. It features a precise motion system, a suite of safety features, and compatibility with all standard wire and bond lengths, making it an ideal choice for the high-volume assembly of microelectronic devices.