Used MPP / MICRO POINT PRO iBOND5000 #293660096 for sale

MPP / MICRO POINT PRO iBOND5000 is a state-of-the-art bonding equipment designed to meet the highest requirements in terms of speed, accuracy, and durability. This versatile machine is suitable for various processes including wafer backgrinding, tape-mounting, ball-bonding, wedge-bonding, and die attach. It offers the highest levels of precision and control for all of these applications. MPP iBOND5000 features an advanced optics system which enables it to accurately align the part prior to bonding, thus ensuring reliable and high-accuracy results regardless of part size. The machine's plotting unit ensures precise plotting and pinpoint accuracy with every bond, enabling it to quickly and accurately bond parts with any shape and any reasonable substrate thickness. MICRO POINT PRO iBOND5000's heating machine is designed to precisely and consistently bond parts at a range of temperatures, making it suitable for a variety of materials including copper, gold, aluminum, and thermoplastic. The tool is equipped with an advanced thermocouple to give accurate temperature readings and to optimize the process. IBOND5000 also includes fully automated pressure control during the bonding process, ensuring perfect bonding every time. The machine is also capable of producing different types of bonds, including linear, wedge, and perfect bond shapes, which further enhance the accuracy of the bond. MPP / MICRO POINT PRO iBOND5000 also includes configurable speed control, enabling it to precisely adjust the bonding speed to the application. MPP iBOND5000 is a reliable, accurate, and powerful bonder that is capable of meeting the highest standards of performance for a wide range of applications. Its robust design and advanced technology make it the ideal solution for high-volume, precision bonding. Its available customization options make it a versatile and powerful solution that can be tailored to the customer's exact requirements.