Used MRSI 505 #9232214 for sale

MRSI 505 is a state-of-the-art die attacher made by MRSI Systems specifically designed for potting, die attaching, and device encapsulation applications. It has high-temperature and power capacity to help ensure precise and reliable metallization and die attach results. The temperature range of the machine is from ambient up to 500°C, with die attach stamping force up to 200 Newtons. 505's two-axis motion equipment is constructed from high strength stainless steel components, complete with anti-backlash gearboxes and durable bellows seals providing a rigid consistent movement over its entire travel distance. The system is capable of coordinated motion of the X/Y axes, allowing simultaneous movement of three axes without an additional controller. Its repeatability and accuracy is also exceptional, sustaining 0.04 mil positional accuracy over its entire travel range. Its removable side-mounted AC heating element and silicone rubber boot provide consistent heat emission onto the die for secure and reliable metallization processes. The reliable performance and repeatability of MRSI 505 provides a superior performance over traditional hot bar systems and facilitates high quality assembly. The unit is also composed of a laser/spot thermometer which provides direct feedback on die temperature to ensure proper application. The machine is capable of manual, semi-automatic, or full automatic speed and indexing control capabilities to suit customer operations. Its user interface is designed for easy touchscreen operation, and it features flexible software control for programming pick-and-place operations, die attach processes, and intricate device configurations. The machine is outfitted with an array of safety protocols to ensure operator convenience and productivity. Its advanced leak detection machine, prevents potential tool failure caused by coolant leakage or excessive ambient temperatures. The machine is also equipped with a safety stop and a vacuum detections asset for secure and efficient operation. Overall, 505 is an ideal die attach solution for a range of potting and die attach applications. Its solid construction, consistent performance, and advanced safety protocols make it an ideal solution for device fabrication and encapsulation processes.