Used MRSI 705 #293623380 for sale

MRSI 705 is an automatic flip/chip ball grid array (FC/BGA) die bonder designed for a number of high reliability microelectronic assembly applications. This bonder has a precision automatic die movement system that is able to precisely control and accurately place up to three stacked dice at predetermined X/Y-axis locations and theta values. Additionally, 705 is designed to be compatible with multiple die sizes and pitches, up to and including die with pitches of 25 mils (0.64 mm). This bonder has a number of advanced workflow and design features which help to ensure accuracy and repeatability with each die placement operation. MRSI 705 is able to control multiple die sizes, feed times, and X/Y/theta placement accuracy. Additionally, the built in "pattern repeat" feature allows for the placement of multiple dice from the same part number at the same time. The multiple pre-set or custom recipe functions allow for placement parameters to be quickly recalled and executed with ease, helping to further improve efficiency. 705 is also equipped with an integrated vision system and powerful imaging capabilities for assessing die alignment, placement accuracy, and other various parameters. This feature helps to provide accurate visual feedback in order to identify and correct any potential defects before bonding. The ergonomically designed user interface also helps to simplify operation and ensure easy compatibility with existing SMT lines. MRSI 705 is designed to provide a quick and efficient solution for high precision microelectronic assembly and offers a combination of high-end features and increased production capabilities. This bonder is ideal for those looking for an advanced die bonding solution that can help to improve accuracy and throughput in a range of high-reliability assembly processes.