Used MRSI 705 #9372421 for sale

MRSI 705 is a precision thermocompression bonder from MRSI Systems. It was specifically designed to meet the widely growing interest in 3D interconnects in the electronics industry. Working as a thermosonic bonder, it features an advanced controller technology offering a larger, easy-to-navigate touchscreen. Additionally, the machine's large working area and fast process times make it a viable solution for most applications. 705 is designed with semiconductor, photonics, and microelectromechanical systems (MEMS) in mind. It can bond a wide variety of materials including precious metals, dielectric materials, adhesives, and complex substrates. The machine features a high-resolution, low-profile chuck to securely hold the workpiece during the bonding process. It also contains a SST Thermosonic Bond Head for precision and reliability in the thermosonic process, as well as built-in thermocouples to monitor the temperature and presence of the substrate. MRSI 705 bonder offers a number of options designed to produce the highest quality bonds. Such options include a high throughput of up to 100mm/sec, a specialized cleanroom package, and an interruptible heating ramp. Additionally, the bonder offers a smart pulse that uses pressure and temperature to control the bonding parameters. This feature allows for precise and reliable bond outcomes without line blur. 705 is compatible with PC and PLC-based systems, as well as available MRSI software. This allows for the creation of custom bond cycles and interfacing with LabView. The integrated Energy Assistant software enables quick and easy adjustment of parameters for faster runs, as well as enhanced process control. MRSI 705 is known to be a reliable and flexible tool for producing high-yield, high-quality bonds. It is also known for its performance and repeatability, so it is ideal for high-production environments. In short, 705 is a solid choice for any bonding application requiring reliability and precision.