Used MUHLBAUER CMI 2000/05 #9276220 for sale

MUHLBAUER CMI 2000/05 is an automated, high-speed chip bonder designed for use in a variety of semiconductor and electronic device manufacturing applications. MUHLBAUER CMI 2000/05 features a backlight prevention equipment that enables stable and precise bonding of sorts without the need to adjust the light source. Its state-of-the-art X/Y/Twin axis movements ensure high accuracy and productivity. This bonder also comes equipped with a vision system to identify and move chips easily, reducing time and cost to set up a bonding unit. MUHLBAUER CMI 2000/05 features a modular design, which enables easy integration of various modules, including bonding heads, vision systems, chuck holders, and bonder arms. This model also includes a user-friendly touch panel for controlling the machine, allowing operators to control parameters such as temperature and speed through the touch of a button. Additionally, this model has advanced thermal design, with special attention paid to the heat dissipation characteristics of the equipment, enabling long-term stable operation with reduced cooling requirements. MUHLBAUER CMI 2000/05 has a versatility that allows its use in various industries such as medical device manufacturing, automotive and consumer electronics. Its process integrity is safeguarded by features such as a die-crack monitor, high speed XY motion, low background light, 3D vision integration and a programmable timer. This bonder uses laser, ultrasonic, thermosonic or thermal compression force. It is capable of handling cantilever, box or wedge shaped chips with sizes ranging from 150 μm to 5000 μm in width. Finally, this state-of-the-art bonder is also equipped with high-precision temperature controlling algorithm which enable highly accurate temperature control, ensures the perfect bonding of parts, and lets it bond multiple parts at the same time.