Used NATIONAL INSTRUMENTS / NI 9923 #9198181 for sale

NATIONAL INSTRUMENTS / NI 9923 is a powerful bonder for applications requiring high throughput and accuracy. It is designed to provide efficient bonding solutions for a variety of small to medium size components, including transistors, capacitors, etc. NI 9923 utilizes a high frequency microwave source to create an ideal robust on-chip interconnection. It can bond up to 50 connections per second, making it an ideal choice for high volume production. The frequency of the bonds is user programmable and adjustable from 0 kHz to 30 kHz. The bonder has an adjustable atmospheric pressure ranging from 1,000 mbar up to 66 mbar for those needing more pressure to secure components on the board. NATIONAL INSTRUMENTS 9923 ensures precise control and exact alignment of components, resulting in a reliable and strong connection. Its optical alignment system accurately detects component alignment, with accuracy up to 10 µm, and is capable of producing 0603, 0402, and other standard resistors and capacitors. 9923 has an enhanced temperature range up to 300°C, with precise temperature control for consistent system performance as controlled by the built-in closed-loop control system. This enables automated and repeatable processes when working with temperature-sensitive components. NATIONAL INSTRUMENTS / NI 9923 offers efficient and reliable data transfer, with a USB 2.0 connection offering data speeds up to 480 Mbps. The integrated Ethernet port allows for remote connection, control, and monitoring of the bonder from any computer across the network. The bonder also includes advanced safety features designed to protect both the user and the machine itself. NI 9923 is a robust bonder that provides reliable performance and accuracy when bonding a wide variety of components. Its adjustable power, temperature, and speed features provide users with flexible control and reliable operation. Its advanced safety features ensure the user and the machine are safe during operation, providing a secure and consistent bonding process.