Used NEWPORT MRSI 705 #293764050 for sale

NEWPORT MRSI 705 bonder is a revolutionary automated wafer bonding instrument for high precision die-to-substrate and flip chip interconnections. It is highly reliable, and as a result offers very consistent bonding and precise alignment of both hard and soft devices. By utilizing a proprietary three-axis inverted dual-zone scanning equipment, it is able to achieve both high-speed macron bonding and high-precision micron-scale registration with excellent accuracy. NEWPORT 705 utilizes a precision inverted dual-zone scanning system, allowing for both wafer scale (macron) bonding and device-level (micron) interconnect alignment. The high accuracy of the inverted dual-zone scanning unit is achieved by the combination of a closed-loop positional feedback machine and a programmable servo-motor control. This eliminates any possible variation in positioning between each bond. MRSI 705 is equipped with a variety of bond heads to accommodate different flip chip bonding challenges. This includes a 300um pitch bonder head for high density components, as well as a damage-free wire bonder head. 705 is also designed to be compatible with various types of wafer materials, including quartz, silicon, glass, and ceramic, while also operating optimally on aluminum materials. Furthermore, NEWPORT MRSI 705 is equipped with a detailed graphical user interface. This allows users to easily and intuitively configure, monitor, and control their bond process in both real-time and post-process data gathering. The intuitive software offers various bonding modes for different application requirements, while also providing an extensive online library of recipes for precise process setup. In conclusion, NEWPORT 705 bonder is the latest breakthrough in precision die-to-substrate and flip-chip interconnection bonding. Utilizing a highly advanced automated tool, users are able to achieve consistent and reliable results with excellent accuracy for both macron and micron-scale interconnections. MRSI 705 is incredibly easy to use due to its intuitive graphical user interface, while also providing a wide range of bond head options to suit various applications.